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esd oven
Specialized for dehumidification of BGA/IC components

esd oven

A precision device designed specifically for dehumidifying BGA/IC components, achieving precise temperature control of 125±5℃ and a temperature uniformity of ±5℃. Equipped with ESD anti-static design and data recording and traceability functions, it provides a "safe, controllable, and traceable" dehumidifying environment for sensitive devices.

Technical Specifications Consult Customization

ESD Anti-Static Protection

The entire machine adopts anti-static materials and grounding design, with static voltage in the work area ＜100V. It eliminates static damage to sensitive components like BGA/IC, ensuring component reliability.

Precise Temperature Control & Uniformity

Achieves precise temperature control of 125±5℃ with ±5℃ temperature uniformity. It ensures uniform moisture removal from all parts of BGA/IC components, avoiding local overheating or incomplete moisture removal.

Data Recording & Traceability

Built-in data recording system can store and export parameters such as temperature curves and time for each batch of moisture removal. It meets the traceability requirements of the electronics industry.

Full Process of BGA/IC Moisture Removal

BGA/IC components easily absorb moisture during storage or transportation. If moisture is not completely removed before soldering, the expanding moisture during high-temperature soldering will cause solder joint cracking and component failure. The anti-static precision oven achieves safe and efficient component moisture removal through "precise temperature control + ESD protection".

Step 1: Anti-Static Loading

Operators wear anti-static wristbands, place BGA/IC components into anti-static trays, and then feed them into the oven. Static and physical damage are avoided throughout the process.

Step 2: 125±5℃ Moisture Removal

The oven heats up to 125±5℃, and hot air circulation uniformly heats the components to fully release internal moisture. Meanwhile, the ESD protection system works continuously to ensure static safety.

Step 3: Cooling & Data Recording

After moisture removal is completed, the oven cools down slowly. The data system automatically records parameters such as the temperature curve and duration of this moisture removal batch. After cooling, the components are taken out for the soldering process.

Internal Structure of Anti-Static Oven

Detailed Technical Specifications

Applicable Process BGA/IC Component Moisture Removal
Temperature Range Room Temp - 150℃ (Commonly Used: 125±5℃)
Temperature Uniformity ±5℃
Heating Method Hot Air Circulation Heating

ESD Protection Parameters

  • • Static Voltage in Work Area: ＜100V
  • • Cabinet Grounding Resistance: ＜1Ω
  • • Tray Material: Anti-Static Polymer Material

Data Recording Function

  • • Temperature Sampling Interval: 1 minute/time
  • • Storage Capacity: ≥1000 Batches of Data
  • • Export Format: CSV/PDF

Moisture Removal Effect Verification

Test Conditions: The initial moisture content of BGA components is 0.8%. After baking at 125℃ for 4 hours, the moisture content of the components stably drops to below 0.05%, meeting the requirements of the electronics industry standard J-STD-033 for moisture removal of sensitive components.

Contact Us

Whether you have any questions or customization needs regarding vacuum sintering furnaces or powder metallurgy equipment, our professional team will provide you with timely and professional services and support.

Company Address

English Headquarters Operation Center: Yunlun Science and Technology Park, No. 333 Chuangda Road, Qingpu District, Shanghai, China

Production Base: No. 198, Shuguang Road, Kunshan City, Suzhou City, Jiangsu Province

Contact Phone/WhatsApp

Manager: +86 19921692198

Email Address

support@gdoven.com

Business Hours

Monday to Saturday: 9:00 - 18:00

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