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Specialized for drying after development/etching/ultrasonic cleaning

Clean Oven

A clean-grade drying equipment specially designed for the drying process after development, etching, and ultrasonic cleaning in the middle stage of PCB production. It creates a dust-free environment at 60-80℃ and has three core advantages: "dust-free, uniform temperature, and adaptability to multiple batches and small quantities". It perfectly solves the defect problems caused by residual moisture/impurities on PCB boards after cleaning, ensuring the quality of subsequent processes.

Front View of Clean-Type Oven

Core Product Value

The Clean-Type Oven focuses on three core scenarios: Post-Development, Post-Etching, and Post-Ultrasonic Cleaning Drying. With three technical advantages—Dust-Free Environment, Precise Temperature Control, and Flexible Batch Processing—it addresses the pain points in industrial coating and curing processes: "short circuits, oxidation, and poor interlayer bonding caused by residual moisture/impurities after cleaning":

  • Dust-Free Environment Guarantee: Built-in air purification system ensures Class 100 cleanliness in the working area, preventing secondary contamination of industrial workpieces by dust.
  • Precise Temperature Control & Uniform Drying: Accurate temperature control at 60-80℃ with ±1℃ uniformity, ensuring thorough and even evaporation of moisture on the workpiece surface without local residue.
  • Multi-Batch & Small-Batch Adaptation: Flexible loading methods and process parameter storage perfectly match the multi-variety, small-batch industrial production mode.

Core Technical Features

Class 100 Cleanliness System

Equipped with a HEPA high-efficiency filter (H14 class) and positive-pressure airflow design, the working area achieves Class 100 (ISO Class 5) cleanliness, eliminating dust and particle contamination on industrial workpieces.

Precise Temperature Control & Uniformity

PID intelligent temperature control + multi-point temperature monitoring, with a temperature range of 60-80℃ and temperature uniformity of ±1℃, ensuring even evaporation of moisture on the workpiece surface without residual watermarks.

Clean Hot Air Circulation

Corrosion-resistant centrifugal fan + high-efficiency airflow distribution plate enable 360° dead-angle-free clean hot air circulation, increasing drying efficiency by 30% and avoiding scratches on the workpiece surface.

Intelligent Process Storage

7-inch touchscreen + PLC system supports storage of 20 process curves, adapting to the drying needs of industrial workpieces with different thicknesses and materials, and increasing switching efficiency by 50%.

Flexible Loading Design

Adjustable shelves + anti-static trays support batch loading of single-sided, double-sided, and multi-layer workpieces. Single-batch processing capacity ranges from 100 to 500 pieces (depending on model).

Rapid Dehumidification System

Built-in dual-system of condensation dehumidification + silica gel adsorption quickly reduces the humidity in the working chamber (≤5%RH), shortening drying time and improving production line efficiency.

Technical Parameters & Performance

Core Parameters

Applicable Process Post-Development/Post-Etching/Post-Ultrasonic Cleaning Drying
Temperature Range 60-80℃
Temperature Uniformity ±1℃
Cleanliness Class Class 100 (ISO Class 5)

Filter System:HEPA H14 Class High-Efficiency Filter

Dehumidification System:Dual-System (Condensation + Silica Gel Adsorption)

Working Chamber Size (Optional)

  • • 500×500×500mm
  • • 600×600×600mm
  • • 800×800×800mm
  • • Custom Size

Single-Batch Processing Capacity

  • • Small Model:100-200 Pieces
  • • Medium Model:200-300 Pieces
  • • Large Model:300-500 Pieces

Temperature Uniformity & Cleanliness Test

Temperature Uniformity at 70℃ (30-Min Monitoring)

Cleanliness Test Result

Under static working conditions, the number of particles ≥0.5μm in the working area is ≤100 particles/ft³, meeting the Class 100 (ISO Class 5) cleanliness standard and satisfying the drying needs of high-end industrial products.

Application Scenarios & Processes

Core Application Scenario Processes

Post-Development Drying Process

After workpiece development, residual developer and moisture remain on the surface. If not thoroughly dried, it may cause uneven etching and circuit short circuits in subsequent processes. The Clean-Type Oven uses precise temperature control at 60-70℃ and a dust-free environment to quickly evaporate residual liquids, ensuring circuit clarity.

  1. 1 Preheating:Room Temp → 60℃, 3℃/min, 10min Heat Preservation (Initial Evaporation of Free Water)
  2. 2 Main Drying:60℃ → 70℃, 2℃/min, 20min Heat Preservation (Complete Evaporation of Developer and Bound Water)
  3. 3 Cooling:70℃ → 40℃, Natural Cooling (Avoid Thermal Stress)

Post-Ultrasonic Cleaning Drying Process

After ultrasonic cleaning of workpieces, residual moisture in microholes and on the surface, if not completely removed, can cause oxidation and coating blistering in subsequent processes. The Clean-Type Oven achieves complete evaporation of moisture in microholes and on the surface through high temperature (70-80℃) and strong dehumidification.

  1. 1 Preheating:Room Temp → 70℃, 4℃/min, 10min Heat Preservation (Activate Dehumidification System)
  2. 2 Main Drying:70℃ → 80℃, 2℃/min, 30min Heat Preservation (Deep Evaporation of Moisture in Microholes)
  3. 3 Dehumidification & Cooling:80℃ → 40℃, Activate Strong Dehumidification, Cool After 10min Heat Preservation

Other Extended Scenarios

Post-Etching Drying

After etching, residual etchant and moisture remain on the workpiece surface. Clean drying at 60-70℃ prevents copper surface oxidation and circuit corrosion caused by residual liquids.

Solder Mask Ink Pre-Drying

After industrial coating printing, pre-drying at 60℃ in a clean environment can initially cure the ink, preventing ink flow and adhesion in subsequent processes.

FPC Flexible Board Drying

Flexible FPC boards are sensitive to materials. Gentle drying at 60℃ in a dust-free environment prevents board deformation and surface contamination.

Successful Application Cases

Continuous Drying Solution for Precision Manufacturing
Industry Solutions

Continuous Drying Solution for Precision Manufacturing

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosPrecision Tunnel-Type Continuous Drying Line3 linesTemperature Control Range: 50~200℃ (Accuracy ±0.3℃); Conveying Speed: 0.2~1.5m/min (frequency-variable adjustable); Drying

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Industrial Material Curing Solution
Industry Solutions

Industrial Material Curing Solution

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosMulti-layer Board Lamination & Curing Machine4 unitsTemperature Control Range: Room Temperature ~ 220℃ (Accuracy ±0.5℃); Lamination Pressure: 0.5~5MPa (Adjustable); Heati

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Contact Us

Whether you have any questions or customization needs regarding vacuum sintering furnaces or powder metallurgy equipment, our professional team will provide you with timely and professional services and support.

Company Address

English Headquarters Operation Center: Yunlun Science and Technology Park, No. 333 Chuangda Road, Qingpu District, Shanghai, China

Production Base: No. 198, Shuguang Road, Kunshan City, Suzhou City, Jiangsu Province

Contact Phone/WhatsApp

Manager: +86 19921692198

Email Address

support@gdoven.com

Business Hours

Monday to Saturday: 9:00 - 18:00

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